| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
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暂无价格
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参考库存:42129
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散热片
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散热片 maxiFLOW superGRIP BGA Heatsink, T766, Blue-Anodized, 32.25x32.25x12.5mm
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1:¥135.8486
10:¥128.3228
50:¥113.2599
100:¥105.7341
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参考库存:42134
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散热片
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散热片 Chipset Heatsink with Clip, Elliptical, 19mm Chip Size, 20.6mm Height, Aluminum, Black Anodized
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暂无价格
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参考库存:42139
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散热片
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散热片 Chipset Heatsink with Clip, Pin Fin, 33mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
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暂无价格
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参考库存:42144
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散热片
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散热片 maxiFLOW superGRIP BGA Heatsink, T766, Blue-Anodized, 44.25x44.25x17.5mm
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1:¥154.3693
10:¥145.8378
50:¥128.6279
100:¥120.0964
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参考库存:42149
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