| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 superGRIP Heatsink Assembly, Straight Fin, Low Profile, T766, Black-Anodized, 36.75x36.75x14.5mm
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100:¥106.2652
500:¥96.7393
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参考库存:40213
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散热片
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散热片 Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
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暂无价格
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参考库存:40218
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散热片
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散热片 Standard active cooling solution for high performance COM Express module conga-TFS with 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
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暂无价格
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参考库存:40223
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散热片
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散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, T412, 45x45x9.5mm, 61.5mm Fin Tip
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暂无价格
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参考库存:40228
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散热片
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散热片 Heatsink for Plastic BGA Packages, Black Anodized, 35x35x10mm, IC Pkg Size = 35 x 35, Tape #35
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暂无价格
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参考库存:40233
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