| 图片 | 型号 | 制造商 | 描述 | 参考价格 | 库存数量 | 询价 |
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散热片 HEATSINK w/ FAN FOR Express-MV
PDF数据手册
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暂无价格
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参考库存:41565
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散热片 Extruded Style Heatsink for TO-218, Large Radial Fins, Vertical Mounting, 5.7 n Thermal Resistance, Black Anodized, 2.67mm, Device Clip #52 Hole, 25.4x21.59mm
PDF数据手册
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暂无价格
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参考库存:41560
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散热片 Heat Pipe, Copper, High Performance, Round, 550mm, 9.5mm dia.
PDF数据手册
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1:¥196.4053
10:¥184.8793
25:¥173.3533
50:¥161.7482
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参考库存:8886
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散热片 Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
PDF数据手册
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暂无价格
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参考库存:41553
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散热片 maxiFLOW Heatsink with maxiGRIP Attachment, T766, Blue-Anodized, 32.5x32.5x7.5mm
PDF数据手册
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暂无价格
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参考库存:41548
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散热片 Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x38.1mm, (1) 10-32UNF, 0.625 Inch Thread Depth
PDF数据手册
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暂无价格
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参考库存:41543
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散热片 Kool-Klips Clip Cover for TO-218, TO-220, TO-247, 37.08mm
PDF数据手册
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暂无价格
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参考库存:41538
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散热片 Semiconductor Mounting Pad for TO-5
PDF数据手册
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暂无价格
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参考库存:41533
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1:¥9,248.9257
5:¥8,930.1188
10:¥8,632.4316
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参考库存:41528
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暂无价格
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参考库存:41523
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暂无价格
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参考库存:41518
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散热片 BGA Heatsink, 23x15mm, Side Plastic Push Pin
PDF数据手册
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暂无价格
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参考库存:41513
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散热片 Standard heatspreader for COM Express module conga-TCA3. All standoffs are 2.7mm bore hole.
PDF数据手册
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暂无价格
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参考库存:41508
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散热片 Passive cooling solution for conga-PA3. Includes conga-PA3/HSP heatspreader and heat sink with 12mm fins. All standoffs are with 2.7 mm bore hole.
PDF数据手册
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暂无价格
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参考库存:41503
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散热片 Semiconductor Mounting Pad for TO-5, Nylon
PDF数据手册
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暂无价格
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参考库存:41498
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散热片 Vertical Mount Heatsink for TO-220, 25.4x12.7x24.1mm, Aluminum, Black Anodized
PDF数据手册
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暂无价格
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参考库存:41493
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散热片 blueICE BGA Heatsink, High Performance, Ultra Low Profile, Gold-Anodized, Saint-Gobain C675, >=45mm Comp, 61x58.2x5.5mm
PDF数据手册
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暂无价格
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参考库存:41488
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散热片 27MM PIN FIN HEASINK ASSEMBLY
PDF数据手册
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暂无价格
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参考库存:41483
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散热片 BGA Cooling Solutions with superGRIP Attachment, High Performance, 32.5x32.5x12.5mm
PDF数据手册
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1:¥128.7861
10:¥121.7123
50:¥107.35
100:¥100.1971
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参考库存:9064
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散热片 7 FINS,2.000 OD HS W/4 LEGS 37.5MM CLIP
PDF数据手册
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暂无价格
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参考库存:41476
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