| 图片 | 型号 | 制造商 | 描述 | 参考价格 | 库存数量 | 询价 |
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP higher than 17W * VC = vapor
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暂无价格
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参考库存:39214
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CPU与芯片冷却器 Passive cooling solution for conga-PA5 based on open silicon Pentium and Celeron processors and heat sink with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole.
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暂无价格
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参考库存:39139
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
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暂无价格
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参考库存:39114
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CPU与芯片冷却器 Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are 2.7mm bore hole.
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暂无价格
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参考库存:39094
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CPU与芯片冷却器 Passive cooling solution for conga-IA5 based on lidded Atom E3900 processors with 12mm heatsink fins.
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暂无价格
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参考库存:39014
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CPU与芯片冷却器 Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs
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暂无价格
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参考库存:38777
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:38517
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CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
PDF数据手册
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暂无价格
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参考库存:38512
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CPU与芯片冷却器 Passive cooling solution for conga-IA5 based on open silicon Pentium and Celeron processors with 12mm heatsink fins.
PDF数据手册
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暂无价格
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参考库存:38382
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CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread.
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暂无价格
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参考库存:38332
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CPU与芯片冷却器 Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
PDF数据手册
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暂无价格
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参考库存:37842
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * VC= Vapor Chamber * T =M2.5
PDF数据手册
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暂无价格
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参考库存:37822
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
PDF数据手册
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暂无价格
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参考库存:37657
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:37647
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CPU与芯片冷却器 Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = Copper plate * B = 2.7mm Bor
PDF数据手册
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暂无价格
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参考库存:37607
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP higher than 17W * VC = Vapo
PDF数据手册
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暂无价格
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参考库存:37207
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CPU与芯片冷却器 Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are M2.5mm threaded.
PDF数据手册
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暂无价格
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参考库存:37182
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CPU与芯片冷却器 Passive cooling solution for conga-PA5 based on lidded Atom E3900 processors with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole.
PDF数据手册
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暂无价格
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参考库存:37122
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CPU与芯片冷却器 Pico-ITX chassis with passive cooling for conga-PA5 with non-lidded Intel Celeron and Pentium processors with IO shield, LED's, power button, 2x USB 2.0, 2.5" HDD mount, 2x antenna holes, 1x UART hole, VESA mounting. Vendor: AKASA
PDF数据手册
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暂无价格
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参考库存:37102
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * VC = Vapor Chamber * B = 2.7
PDF数据手册
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暂无价格
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参考库存:37052
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